Indium Corporation Semiconductor Power Semiconductor Assembly Visit Our Website Products Services About Contact Us Main INDIUM CORPORATION Blog From One Engineer to Another Electromigration EM and Electrochemical Migration ECM Sunday , January 30, 2011 by Andy Mackie Andy Mackie I was asked this week to contribute to the upcoming IPC handbook IPC-CH-65 HDBK on the section on contamination and its effects on printed wiring assemblies PWA's There is a clear crossover of technology from the standard SMT PCB arena into semiconductor assembly : specifically into flip-chip , nbsp microbumps and TSV assembly . However , nbsp the terminology is starting to collide phrases familiar to semiconductor manufacturers now need to be understood and become part of the lexicon of semiconductor packaging
Thanks to Future Horizons for this one - reasons why IC prices will be high this year:
Semiconductor Power Semiconductor Assembly Visit Our Website Products Services About Contact Us Main INDIUM CORPORATION Blog From One Engineer to Another Epoxy Flux Dipping for CSP and PoP Applications Friday , January 14, 2011 by Andy Mackie Andy Mackie This week a customer in Asia asked why one of our new epoxy fluxes was not allowing the package-on-package PoP device to be picked up from the dipping tray . Obviously , the vacuum nozzle must have sufficient force to extract the PoP package from the PoP flux reservoir yellow , below Those of you who know me also know that I am always trying to reduce things to numbers so , naturally I got thinking about how I would model this from a physical viewpoint and came up with the : following If the downward force weight of component plus tack